B&R IC-08A Dot Repairing Soldering Lug Patch For Motherboard Repair

The B&R iC-08A Quickly Dot-Repairing Soldering Lug Set is an advanced, ultra-thin hardware patch solution engineered specifically for micro-soldering professionals and mobile phone motherboard technicians. It serves as a revolutionary replacement for traditional jumping wires (flywires), allowing you to restore missing, torn, or dropped solder pads on cell phone logic boards and BGA chips in a fraction of the time.

Key Features

• Eliminates Tedious Flywires: Replaces the painstaking process of looping and routing traditional copper wire. Instead of spending 15–20 minutes on a single trace, simply place the matching lug, solder it down, and the pad is perfectly restored to factory efficiency.

• Massive Variety of Pad Shapes: The sheet is populated with an extensive selection of pre-cut solder pad geometries—including circular dots, square joints, and elongated signal traces—ensuring you have the exact match for any missing node.

• Ultra-Thin & Flush Profile: Micro-engineered to be incredibly thin so it adds zero extra height to the board. This prevents clearance issues when reflowing mid-layer boards, re-seating CPUs, or reballing thick audio, power, or baseband ICs.

• Stable and Secure Anchoring: Designed with fixed contact pins that grip the board firmly once soldered. Unlike loose wire loops, these lugs will not shift, bend, or detach when exposed to subsequent hot air rework or chip placements.

• High Conductivity: Made with premium, highly conductive copper materials coated to prevent oxidation, ensuring flawless signal transmission and excellent solder wetting properties.

Technical Specifications

• Brand: B&R

• Model: iC-08A

• Category: Motherboard Maintenance / BGA Rework Supplies

• Material: Ultra-thin, high-purity copper composite

• Application: Universal repair for iPhone, Samsung, and Android logic boards, face ID/fingerprint flex cables, and multi-layer PCBs

Primary Workflow Applications

The B&R iC-08A sheet is a massive time-saver for high-volume repair shops dealing with physical drop damage or pad tearing during chip removal. It is ideal for:

• Under-Chip Pad Restoration: Rebuilding damaged pads beneath heavy BGA chips (e.g., CPU, Wi-Fi modules, Power ICs).

• Double-Layer Motherboard Syncing: Re-establishing solid contact nodes on modern split-board phone designs.

• Flex Cable Repair: Re-joining severed trace lines on delicate proximity, audio, or button flex ribbons.