Achieve flawless BGA IC reballing with our high-quality stencil. Designed for professional repair technicians, this tool ensures accurate placement of solder balls, minimizing the risk of damage and maximizing repair success.
- Precise Hole Alignment: Guarantees perfect positioning of solder balls for optimal results.
- Durable Construction: Built to withstand the rigors of repeated use.
- Versatile Compatibility: Suitable for a wide range of BGA chips and devices.
- Improved Efficiency: Streamlines the reballing process, saving time and effort.
- Note: This product is intended for professional use and requires technical expertise.
BGA IC Reballing Stencil/Mini1/IPD2
