The 2UUL SC88 IC Micro-Point Pry Needle Set is a high-precision tool engineered for delicate electronic repairs, specifically designed for prying and removing BGA IC chips from mobile phone and tablet motherboards.Combining lightweight ergonomics with high-strength materials, this set provides technicians with the control needed to navigate dense PCB layouts without damaging surrounding components.
Key Features:
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Ultralight Carbon Fiber Handle: The set includes a premium carbon fiber handle (DA29) that offers exceptional strength while remaining incredibly lightweight.This design reduces hand fatigue during long, intricate repair sessions.
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Precision Micro-Point Design: The needles feature highly elastic, ultra-fine tips.This allows for precise point-penetration, making it easy to embed the tool under chips and pry them up safely.
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Non-Magnetic & Anti-Static: Optimized for motherboard work, the tool is non-magnetic to prevent interference with sensitive electronic components and surface-mount devices.
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Superior Maneuverability: Weighing approximately 22g, the balanced design ensures maximum stability and tactile feedback when working on fragile solder joints and underfill glue.
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Durability and Versatility: The high-precision pry pins are built for durability and can handle various tasks including IC disassembly, glue removal, and prying small connectors.
Specifications:
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Model: SC88
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Handle Material: Ultralight Carbon Fiber
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Total Weight: ~22g
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Applications: iPhone/Android motherboard repair, BGA IC removal, PCB maintenance.
Package Includes:
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1 x Ultralight Carbon Fiber Handle
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2 x Precision IC Micro-Point Pry Needles
