BGA Chip remover pry tool kit (5 Pcs)

The BEST BST-70 is a professional-grade repair kit designed specifically for the most delicate motherboard tasks, including CPU prying, IC removal, and black glue cleaning. Featuring an array of ultra-thin, high-flexibility stainless steel blades, this set provides technicians with the surgical precision required to navigate the tight gaps between chips and circuit boards without damaging sensitive solder pads.

Key Features

• Ultra-Thin 0.7mm Blades: Engineered for maximum accessibility, the 0.7mm profile allows the blades to slide effortlessly beneath BGA chips, CPUs, and NAND flash modules.

• High-Flexibility Stainless Steel: Crafted from “capricious” high-quality stainless steel, these blades are designed to bend under pressure and return to their original shape, preventing snaps during difficult prying operations.

• 10-Piece Multi-Head Selection: The set includes 10 distinct blade shapes (including models 70A through 70E), providing specialized edges for scraping, lifting, prying, and slicing through factory underfill glue.

• Anti-Skid Precision Handles: Ergonomically designed handles with a textured, anti-slip grip ensure absolute control during high-heat rework, reducing the risk of accidental slips that could damage traces.

• Glue Cleaning Specialist: Specifically optimized for removing “Black Glue” and hardened underfill around iPhone and Android processors, ensuring a clean surface for reballing.

• Pad Protection Technology: The hand-polished, smooth edges are designed to “ease” between the chip and the PCB, significantly reducing the risk of “leading off points” or tearing solder pads.

Technical Specifications