X6 – Motherboard Heating Platform (iPhone X To 11 Pro Max)

Take the risk out of logic board separation. The X6 Motherboard Heating Platform is an essential, professional-grade preheating station engineered specifically for desoldering, separating, and reballing double-stacked iPhone logic boards. By delivering ultra-precise, localized thermal control, the X6 prevents the component shifting and thermal stress common with traditional hot air guns.

• Tailored iPhone Compatibility: Includes high-precision CNC-machined synthetic stone molds perfectly mapped for the unique geometry of iPhone X, XR, XS, XS Max, 11, 11 Pro, and 11 Pro Max logic boards.

• Rapid & Uniform Heating: Equipped with a high-efficiency heating core that reaches optimal separation temperatures in seconds, ensuring even thermal distribution across the entire board surface.

• Safe Separation Design: Eliminates the need for aggressive hot air reflow. By heating the board evenly from underneath, it protects delicate surrounding components, baseband chips, and CPU shielding from heat damage.

• Premium Thermal Insulation: Built with a durable, anti-scald synthetic stone composite body and a heat-resistant outer shell to keep the workstation safe and comfortable during long repair sessions.

• Precision Alignment Pins: Built-in positioning grooves keep the dual-layer boards perfectly aligned, making the subsequent reballing and re-joining process seamless.